Non-Silicone Thermal Conductive Pad

 LiPOLY’s N series is silicone free resin material. None low-molecular- weight siloxane volatilization cause no electrical contact failure. It is suitable for optical products or sensitive electronic components. Thermal conductivity: 1.5~17.0 W/m*K. Hardness Shore OO/50-60 has good thermal conductivity and exhibits the lowest thermal resistance value, especially the thermal conductivity of N800C is as high as 17.0 W/m*K. Shiu Li has professional research and development capabilities which can provide cutting-edge thermal solutions immediately to meet all customers’ need for today’s advanced products.
What is low-molecular-weight siloxane? The chemical formula indicates that the non-reactive cyclic polydimethylsiloxane Ho-[Si(CH3)2O]nH is volatile and volatilizes at any time. For example, when electronic products are in a closed space, the low volatile siloxane will cause obstacles to electrical contacts.

  • N700A-s
    Datasheet
  • N700B-s
    Datasheet
  • N700C-s
    Datasheet
  • N800AH-s
    Datasheet
  • N800A-s
    Datasheet
  • N800BH-s
    Datasheet
  • N800B-s
    Datasheet
  • N800CH-s
    Datasheet
  • N800C-s
    Datasheet
  • Product Series Introduction

    Due to Internet of Things raise, electrical products has tendency to lighter, also with high power, high-speed, and high density. Because of the high power module pursued lighter, high density, high power, and the design of the chip and component pursued high capability, high baud, high efficiency, cause the waste heat and hotspot temperature rise quickly, which become the problem in desperate need to solve.